BS EN 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. throughhole, chip mounting, terminal mounting, etc.).


Cross References:
EN 61191-1 (IEC 61191-1:2013) AS
IEC 61191-1:2013
EN 60194 (IEC 60194:2006) AS
IEC 60194:2015
IPC-A-610
EN 61193-3 (IEC 61193-3:2013) AS
IEC 60068-2-20:2008
EN 60068-2-58 (IEC 60068-2-58:2015)AS
IEC 61188-7:2017
EN 60068-2-20 (IEC 60068-2-20:2008)AS
IEC 61188-5-1:2002
IEC 61188-5-4:2007
ISO 9001:2015
EN 61189-2 (IEC 61189-2:1997 Adopted)
IEC 61188-5-5:2007
IEC 61193-1:2001
IEC 62326-1:2002
EN 61188-5-5 (IEC 61188-5-5:2007) AS
IEC 61188-5-6:2003
J-STD-004
IPC-OI-645
J-STD-006
J-STD-005
J-STD-003
EN 62326-4-1
IPC-TM-650
IPC-SM-817
IPC-9191
J-STD-001
J-STD-002
EN 62326-4
J-STD-020
IEC 60068-2-58:2015
EN 61188-5-4 (IEC 61188-5-4:2007) AS
IEC 61193-3:2013
IEC 61188-5-3:2007
IEC 61190-1-2:2014
IEC 62326-4-1:1996
EN 61190-1-2 (IEC 61190-1-2:2014) AS
EN 61188-5-3 (IEC 61188-5-3:2007) AS
EN 61188-7:2017
EN 61188-5-2 (IEC 61188-5-2:2003) AS
IEC 62326-4:1996
IEC 61188-5-2:2003
EN 61193-1 (IEC 61193-1:2001 AS)
EN 61188-5-6 (IEC 61188-5-6:2003) AS
EN 61188-5-1 (IEC 61188-5-1:2002) AS
EN 62326-1 (IEC 62326-1:2002 AS)
IEC 61189-2:2006
EN ISO 9001 (ISO 9001:2015) AS


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