BS EN 61760-4:2015 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling.

This part of IEC 61760 extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging.

This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to

• semiconductor devices,
• devices for flow (wave) soldering.

NOTE Background of this standard and its relation to currently existing standards, e.g. IEC 60749-20 or J-STD- 020 and J-STD-033, are described in the INTRODUCTION.


Cross References:
IEC 60068-1
EN 60068-1
IEC 60749-20
EN 60749-20
IEC 61340-5-1
EN 61340-5-1
IEC 61760-2
EN 61760-2
IPC/JEDEC J-STD-020D.1:2008
IEC 60068-2-58:2004
EN 60068-2-58:2004
IEC 60068-2-78
EN 60068-2-78
IEC 60417
IEC 60749-20-1
EN 60749-20-1
ISO 62
EN ISO 62
ISO 2859-1
ASTM D570
J-STD-033C
JEDEC JESD22-A122
JEDEC JEP113
IPC-T-50G:2005
MIL-PRF-131J
MIL-PRF-27401E:2008


All current amendments available at time of purchase are included with the purchase of this document.