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DANSK DS/EN 62047-25 [ Active ]

Semiconductor devices – Micro-electromechanical devices – Part 25: Silicon based MEMS fabrication technology – Measurement method of pull-press and shearing strength of micro bonding area

standard by Dansk Standard , 12/11/2016

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Full Description

SAME AS IEC 62047-25

IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.

 

Product Details

Edition:
16
Published:
12/11/2016
Number of Pages:
28
File Size:
1 file , 2 MB
Product Code(s):
DS-026, DS-026