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DANSK DSF/FPREN 62435-5 [ Draft ]

Electronic components – Long-term storage of electronic semiconductor devices – Part 5: Die and wafer devices

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DRAFT

This part, covering die and wafer devices, includes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder ball or bumps or other metallisation. This part also covers any special requirements for the primary packaging that to contain the die or wafers for handling purposes whether for automated use or not.

 

Product Details

Edition:
16
Number of Pages:
23
File Size:
1 file , 520 KB
Product Code(s):
DSF-021, DSF-021
 

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    Electronic components – Long-term storage of electronic semiconductor devices – Part 5: Die and wafer devices

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    Electronic components – Long-term storage of electronic semiconductor devices – Part 5: Die and wafer devices

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