2584914

ECIA 540GA00 [ Withdrawn ]

Blank Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment

standard by Electronic Components Industry Association , 01/01/1993

View all product details

Most Recent

Track It

Language:
    • Available Formats
    •  
    • Availability
    • Priced From ( in USD )
    • Secure PDF 🔒
    • Immediate download
    • $30.00
    • Add to Cart
    • Printed Edition
    • Ships in 1-2 business days
    • $30.00
    • Add to Cart

Customers Who Bought This Also Bought

 

About This Item

 

Full Description

W/D NO S/S

The Burn-In Sockets of assessed quality covered by this Detail Specification shall have:

a) Maximum enclosure (maximum length, width, and height dimensions).

b) A working voltage not exceeding _ volts (rms).

c) Current not exceeding _ ampere per pin.

OBJECT

The object of this Detail Specification is to provide all information required for the identification and quality assessment of the Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings. The sockets have solder tail leads. The information contained herein or by reference, is complete and sufficient for inspection purposes.

 

Product Details

Edition:
93
Published:
01/01/1993
Number of Pages:
19
File Size:
0 files