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ECIA CB 5-1 [ Active ]

Recommended Test Procedure for Semiconductor Thermal Dissipating Devices

standard by Electronic Components Industry Association , 05/01/1971

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STABILIZED: 01/2014 * ADDENDUM TO EIA CB 5

The scope of this supplement to EIA Components Bulletin No. 5 is to present methods of instrumentation for plastic case semiconductors and integrated circuits for evaluation of thermal dissipating devices.

 

Product Details

Edition:
71
Published:
05/01/1971
Number of Pages:
14
File Size:
0 files