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ECIA EIA-364-71B [ Revised ]

TP-71b Solder Wicking (Wave Solder Technique) Test Procedure for Electrical Connectors and Sockets

standard by Electronic Components Industry Association , 01/01/2001

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About This Item

 

Full Description

This standard applies to connectors and sockets that are mounted to printed wiring boards (PWB) employing through mount technology.

Object

The purpose of this test is to determine whether a specimen can be wave soldered to a printed wiring board without sustaining damage caused by solder wicking onto the contact surfaces or other areas that might alter its operating characteristics.

 

Product Details

Edition:
B
Published:
01/01/2001
ANSI:
ANSI Approved
Number of Pages:
19
File Size:
0 files
 

Document History

  1. ECIA EIA-364-71C


    TP-71C Solder Wicking (Wave Solder Technique) Test Procedure for Electrical Connectors and Sockets

    • Most Recent

  2. ECIA EIA-364-71C


    TP-71C Solder Wicking (Wave Solder Technique) Test Procedure for Electrical Connectors and Sockets

    • Historical Version

  3. ECIA EIA-364-71C


    TP-71C SOLDER WICKING (WAVE SOLDER TECHNIQUE) TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS

    • Historical Version

  4. ECIA EIA-364-71B

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    TP-71b Solder Wicking (Wave Solder Technique) Test Procedure for Electrical Connectors and Sockets

    • Historical Version

  5. ECIA EIA-364-71B


    TP-71b Solder Wicking (Wave Solder Technique) Test Procedure for Electrical Connectors and Sockets

    • Historical Version

  6. ECIA EIA-364-71A


    TP-71A Solder Wicking (Wave Solder Technique) Test Procedure for Electrical Connectors and Sockets

    • Historical Version

  7. ECIA 364-71


    TP-71 Solder Wicking Test Procedure for Electrical Connectors/Sockets (Wave Solder Technique)

    • Historical Version