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IEC 60191-5 Ed. 2.0 b:1997

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

standard by International Electrotechnical Commission , 04/23/1997

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Full Description

Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
 

Product Details

Edition:
2.0
Published:
04/23/1997
Number of Pages:
71
File Size:
1 file , 570 KB
Note:
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