1850171

IEC 60191-6-10 Ed. 1.0 b:2003

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

standard by International Electrotechnical Commission , 11/19/2003

View all product details

Most Recent

Track It

Language:
    • Available Formats
    • Options
    • Availability
    • Priced From ( in USD )
    • Printed Edition
    • Ships in 1-2 business days
    • $95.00
    • Add to Cart

Customers Who Bought This Also Bought

 

About This Item

 

Full Description

IEC 60191-6-10:2003 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON).
 

Product Details

Edition:
1.0
Published:
11/19/2003
Number of Pages:
24
File Size:
1 file , 440 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 60191-6-10 Ed. 1.0 b:2003

    👀 currently
    viewing


    Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

    • Most Recent

  2. IEC 60191-6-10 Ed. 1.0 en:2003


    Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

    • Historical Version