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IEC 60749-10 Ed. 1.0 b:2002 [ Withdrawn ]

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock

standard by International Electrotechnical Commission , 04/09/2002

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Full Description

Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation. Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test. It is normally applicable to cavity-type packages.
 

Product Details

Edition:
1.0
Published:
04/09/2002
Number of Pages:
7
File Size:
1 file , 400 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 60749-10 Ed. 2.0 b:2022


    Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly

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  2. IEC 60749-10 Ed. 1.0 b:2002

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    Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock

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Amendments, rulings, supplements, and errata

  1. IEC 60749-10 Ed. 1.0 b COR. 1:2003

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    Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock