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IEC 61188-1-2 Ed. 1.0 b:1998 [ Withdrawn ]

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

standard by International Electrotechnical Commission , 04/29/1998

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Full Description

The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.
 

Product Details

Edition:
1.0
Published:
04/29/1998
Number of Pages:
83
File Size:
1 file , 470 KB
Note:
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