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IEC 61189-3 Ed. 2.0 en:2007

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

standard by International Electrotechnical Commission , 10/09/2007

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Full Description

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major changes with regard to the previous edition concern the addition of 25 new test methods and the deletion of Annex B.
 

Product Details

Edition:
2.0
Published:
10/09/2007
Number of Pages:
118
File Size:
1 file , 4.6 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 61189-3 Ed. 2.0 b:2007


    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

    • Most Recent

  2. IEC 61189-3 Ed. 2.0 en:2007

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    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

    • Historical Version

  3. IEC 61189-3 Ed. 1.1 b:2006


    Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) CONSOLIDATED EDITION

    • Historical Version