1537786

IPC 7525A

Stencil Design Guidelines

standard by Association Connecting Electronics Industries , 02/01/2007

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Full Description

Now includes support for stencils used with lead free processes.

This document provides guidelines for the design and fabrication of stencils for solder paste and surface-mount adhesive. Stencil design for various surface-mount technology, as well as mixed technology with through-hole or flip chip components is discussed. This includes differences for tin lead and lead free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.
 

Product Details

Published:
02/01/2007
Number of Pages:
28
File Size:
1 file , 800 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. IPC 7525C


    Stencil Design Guidelines

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  2. IPC 7525B


    Stencil Design Guidelines

    • Historical Version

  3. IPC 7525B


    Stencil Design Guidelines

    • Historical Version

  4. IPC 7525A

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    Stencil Design Guidelines

    • Historical Version

  5. IPC 7525


    Stencil Design Guidelines

    • Historical Version