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ISO 9453:2020

Soft solder alloys - Chemical compositions and forms

standard by International Organization for Standardization , 09/01/2020

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Full Description

ISO 9453:2020 specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.

An indication of the forms generally available is also included.

 

Product Details

Edition:
4th
Published:
09/01/2020
Number of Pages:
20
File Size:
1 file , 1000 KB
Same As:
DIN EN ISO 9453, BS EN ISO 9453:2020
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. ISO 9453:2020

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    Soft solder alloys - Chemical compositions and forms

    • Most Recent

  2. ISO 9453:2014


    Soft solder alloys - Chemical compositions and forms

    • Historical Version

  3. ISO 9453:2006


    Soft solder alloys - Chemical compositions and forms

    • Historical Version

  4. ISO 9453:1990


    Soft solder alloys - Chemical compositions and forms

    • Historical Version