1762555

JEDEC JESD 9-A

METAL PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES AND COVERS

standard by JEDEC Solid State Technology Association , 04/01/1987

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Full Description

This standard establishes the general requirements and quality assurance provisions that can be specified and met in procuring microelectronics packages and covers, manufactured from matched seal with and without high thermal conductivity base materials, intended for use in fabricating hybrid microelectronics circuits. This document details those minimum requirements necessary for metal packages' use exclusively.
 

Product Details

Published:
04/01/1987
Number of Pages:
55
File Size:
1 file , 810 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. JEDEC JESD9C (R2023)


    Inspection Criteria for Microelectronic Packages and Covers

    • Most Recent

  2. JEDEC JESD9B


    Inspection Criteria for Microelectronic Packages and Covers

    • Historical Version

  3. JEDEC JESD 9-A

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    METAL PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES AND COVERS

    • Historical Version