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Today's NFPA 318 safeguards people and property in plants and research facilities.

NFPA 318: Standard for the Protection of Semiconductor Fabrication Facilities applies to semiconductor fabrication facilities and comparable R&D areas in which hazardous chemicals are used, stored, and handled--containing a cleanroom or clean zone or both. For the 2009 edition, the document's scope was revised to apply to semiconductor fabrication facilities and areas with comparable fabrication processes and risks.

Major technical changes for 2009 include:

• First-time requirements for Sub Atomic Gas (SAG) Systems
• New requirements involving exhaust ducts
• Maximum hazardous chemical quantities at a workstation limited to 3 cylinders to reduce change-out frequency
• Revisions to safety considerations for chemical storage and handling, hazardous gas cylinder storage and distribution, bulk silane systems, and production and support equipment

Facility owners and managers, plant safety directors, safety trainers, risk insurers, and AHJs need the latest requirements based on industry needs, new technology, and recent experience.