2592284

TIA TSB-144 [ Revised ]

Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues, and Challenges

standard by Telecommunications Industries Association , 04/01/2003

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Full Description

The bulletin is applicable to fiber optic component reliability. The document is written for fiber optic component manufacturers, as well as end-users, and was prepared by TIA Working Group FO-6.3.1, Adhesives Reliability under the cognizance of FO-6.3 SC Subcommittee on Interconnecting Devices and Passive Products.

 

Product Details

Edition:
03
Published:
04/01/2003
Number of Pages:
22
File Size:
1 file , 260 KB
 

Document History

  1. TIA TSB-144


    Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues and Challenges

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    Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues, and Challenges

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