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About This Item
Full Description
Cross References:
IEC 60068-1
IEC 60068-2-20:1979
IEC 60068-2-20:1979/AMD 2:1987
IEC 60068-2-54:2006
IEC 61190-1-3:2002
ISO 683
ISO 6362
EN 60068-1:1994
CENELEC HD 323.2.20 S3:1988
EN 60068-2-54:2006
EN 61190-1-3:2002
IEC 60068-2-44:1995
EN 60068-2-44:1995
IEC 61190-1-1:2002
EN 61190-1-1:2002
ISO 9453: 2006
EN ISO 9453:2006
ISO 9454-1:1990
EN 29454-1:1993
Document History
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BS EN 60068-2-69:2017+A1:2019
Environmental testing-Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method- Most Recent
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BS EN 60068-2-69:2017
Environmental testing-Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method- Historical Version
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BS EN 60068-2-69:2007
viewing
Environmental testing-Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method- Historical Version
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BS EN 60068-2-54:2006
Environmental testing-Tests-Test Ta: Solderability testing of electronic components by the wetting balance method- Historical Version
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BS EN 60068-2-69:1996
Environmental testing. Test methods-Tests. Test Te. Solderability testing of electronic components for surface mount technology by the wetting balance method- Historical Version
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BS 2011-2.1TA:1989
Environmental testing. Tests-Test Ta. Soldering. Solderability testing by the wetting balance method- Historical Version