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BS EN IEC 62148-21:2021

Fibre optic active components and devices. Package and interface standards-Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

standard by British-Adopted European Standard , 06/15/2021

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Full Description

This part of IEC 62148 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative.

The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.

All current amendments available at time of purchase are included with the purchase of this document.
 

Product Details

Published:
06/15/2021
ISBN(s):
9780539135763
Number of Pages:
20
File Size:
1 file , 1.2 MB
Product Code(s):
30417697, 30417697, 30417697
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This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. BS EN IEC 62148-21:2021

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    Fibre optic active components and devices. Package and interface standards-Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

    • Most Recent

  2. BS EN IEC 62148-21:2019


    Fibre optic active components and devices. Package and interface standards-Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

    • Historical Version