BS EN 61191-3:2017

BS EN 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).


Cross References:
EN 61191-1 (IEC 61191-1:2013) AS
IEC 60194:2015
IEC 61191-1:2013
IPC-A-610
IEC 61193-3:2013
EN 61188-5-5 (IEC 61188-5-5:2007) AS
EN 61188-5-2 (IEC 61188-5-2:2003) AS
IEC 61188-5-1:2002
IEC 61188-5-3:2007
EN 61188-5-3 (IEC 61188-5-3:2007) AS
IEC 61188-7:2017
IEC 61188-5-4:2007
IEC 61190-1-2:2014 ED3
EN 61190-1-2 (IEC 61190-1-2:2014) AS
EN 61188-5-1 (IEC 61188-5-1:2002) AS
IEC 61189-2:2006 Ed 2
IEC 60068-2-58:2015
IPC-9191
J-STD-006
IPC-OI-645
J-STD-001
IPC-TM-650
J-STD-004
J-STD-003
J-STD-005
J-STD-002
IPC-SM-817
EN 62326-4
EN 62326-4-1
J-STD-020
IEC 61188-5-6:2003
IEC 62326-1:2002
EN 61193-1 (IEC 61193-1:2001 AS)
IEC 62326-4-1:1996
EN 61193-3 (IEC 61193-3:2013) AS
IEC 61193-1:2001
IEC 62326-4:1996
EN 60068-2-20 (IEC 60068-2-20:2008)AS
ISO 9001:2015
IEC PAS 62326-7-1:2007
EN 61189-2 (IEC 61189-2:1997 Adopted)
IEC 60068-2-20:2008
EN 61188-5-4 (IEC 61188-5-4:2007) AS
EN 62326-1 (IEC 62326-1:2002 AS)
IEC 61188-5-2:2003
EN ISO 9001 (ISO 9001:2015) AS
EN 60068-2-58 (IEC 60068-2-58:2015)AS
EN 61188-7:2017


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