31.180: Printed circuits and boards

Search Results

  1. BS 01/205138 DC▹

    IEC 61249-4-1. Ed.1. Materials for printed boards and other interconnecting structures. Part 4: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Section 1: Epoxide woven E-glass prepreg of defined flammability (vertical burning test). Section 1: E

    standard by BSI Group, 07/13/2001.

    Languages:

    Track It

  2. BS 02/206657 DC▹

    IEC 61189-5, Ed. 1. Test methods for electrical materials, interconnection structures and assemblies. Part 5: Test methods for printed board assemblies

    standard by BSI Group, 06/06/2002.

    Languages:

    Track It

  3. BS 03/106712 DC▹

    IEC 62326-3 ED.1.0. Printed boards. Part 3. Safety certification of rigid printed circuit boards for electronic assemblies

    standard by BSI Group, 06/02/2003.

    Languages:

    Track It

  4. BS 03/107475 DC▹

    IEC 61249-6-3 ED.1.0. Materials for interconnection structures. Part 6-3. Sectional specification for reinforcements. Woven fibreglass fabrics

    standard by BSI Group, 05/30/2003.

    Languages:

    Track It

  5. BS 07/30153508 DC▹

    BS EN 61249-2-35. Materials for printed boards and other interconnecting structures. Part 2-35. Reinforced base materials, clad and unclad. Modified epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

    standard by BSI Group, 04/20/2007.

    Languages:

    Track It

  6. BS 07/30164957 DC▹

    BS EN 61249-4-14. Materials for printed boards and other interconnecting structures. Part 4-14. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

    standard by BSI Group, 04/20/2007.

    Languages:

    Track It

  7. BS 07/30164961 DC▹

    BS EN 61249-4-15. Materials for printed boards and other interconnecting structures. Part 4-15. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

    standard by BSI Group, 04/20/2007.

    Languages:

    Track It

  8. BS 07/30164965 DC▹

    BS EN 61249-4-16. Materials for printed boards and other interconnecting structures. Part 4-16. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burnin

    standard by BSI Group, 04/20/2007.

    Languages:

    Track It

  9. BS 07/30164969 DC▹

    EN 61249-4-17. Materials for printed boards and other interconnecting structures. Part 4-17. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-fr

    standard by BSI Group, 04/20/2007.

    Languages:

    Track It

  10. BS 07/30164973 DC▹

    EN 61249-2-31. Materials for printed boards and other interconnecting structures. Part 2-31. Reinforced base materials clad and unclad for high frequency application. Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined relative permittivity (equal or less then

    standard by BSI Group, 04/20/2007.

    Languages:

    • 👥MULTI-USER

    Track It