31.190: Electronic component assemblies

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  1. BS 02/208154 DC▹

    IEC 61192-5. Ed.1. Product performance requirements. Part 5: Rework, modification and repair of soldered electronic assemblies

    standard by BSI Group, 08/05/2002.

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  2. BS 04/300295 DC▹

    IEC 62145 ED.1. Crystalline silicon terrestrial photovoltaic (PV) modules. Blank detail specification

    standard by BSI Group, 01/08/2004.

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  3. HISTORICAL

    BS 05/30133283 DC▹

    This document has been replaced. View the most recent version.

    IEC 61190-1-2 ED 2. Attachment materials for electronic assembly. Part 1-2. Requirements for soldering paste for high-quality interconnects in electronics assembly

    standard by BSI Group, 05/04/2005.

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    Historical Editions: BS EN 61190-1-2:2014, BS EN 61190-1-2:2007, BS EN 61190-1-2:2002

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  4. HISTORICAL

    BS 05/30133287 DC▹

    This document has been replaced. View the most recent version.

    IEC 61190-1-3 ED 2. Attachment materials for electronic assembly. Part 1-3. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

    standard by BSI Group, 05/04/2005.

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    Historical Editions: BS EN IEC 61190-1-3:2018, BS EN 61190-1-3:2007+A1:2010, BS EN 61190-1-3:2007, BS EN 61190-1-3:2002

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  5. BS 06/30153520 DC▹

    EN 62468. The marking for presence and absence of the specified chemical substance in materials, components and mounted boards in electrical and electronic equipment

    standard by BSI Group, 07/20/2006.

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  6. HISTORICAL

    BS 07/30169578 DC▹

    This document has been replaced. View the most recent version.

    BS EN 61188-7. Printed board and printed board assemblies. Design and use. Part 7. Sectional requirements. Electronic component zero orientation for CAD library construction

    standard by BSI Group, 07/25/2007.

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    Historical Editions: BS EN 61188-7:2017, BS EN 61188-7:2009

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  7. BS 07/30169763 DC▹

    BS EN 62515. Evaluation criteria for voids in soldered joints of BGA and LGA

    standard by BSI Group, 07/31/2007.

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  8. BS 09/30206176 DC▹

    BS EN 62137-3. Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

    standard by BSI Group, 06/30/2009.

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  9. BS 10/30217644 DC▹

    BS EN 60194. Printed board design, manufacture and assembly. Terms and definitions

    standard by BSI Group, 03/01/2010.

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  10. BS 12/30250506 DC▹

    BS EN 62739-1. Test method for erosion of wave soldering equipment using molten lead-free solder alloy. Part 1. Erosion test method for metal materials without surface processing

    standard by BSI Group, 03/13/2012.

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    • 👥MULTI-USER

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