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About This Item
Full Description
The purpose of this document is to establish a test method that will replicate HBM failures and provide reliable, repeatable HBM ESD test results from tester to tester, regardless of component type. Repeatable data will allow accurate classifications and comparisons of HBM ESD sensitivity levels.
ESD testing of semiconductor devices is selected from this test method, the machine model (MM) test method (see IEC 60749-27) or other ESD test methods in the IEC 60749 series. Unless otherwise specified, this test method is the one selected.
Cross References:
EN 60749-27
IEC 60749
EN 60749
IEC 60749-27
ANSI/ESDA/JEDEC JS-001:2014
All current amendments available at time of purchase are included with the purchase of this document.
Document History
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BS EN IEC 60749-26:2018
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Semiconductor devices. Mechanical and climatic test methods-Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)- Most Recent
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BS EN 60749-26:2014
Semiconductor devices. Mechanical and climatic test methods-Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)- Historical Version
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BS 11/30250232 DC
BS EN 60749-26. Semiconductor devices. Mechanical and climatic test methods. Part 26. Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)- Historical Version
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BS EN 60749-26:2006
Semiconductor devices. Mechanical and climatic test methods-Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)- Historical Version
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BS EN 60749:1999
Semiconductor devices. Mechanical and climatic test methods- Historical Version
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BS 6493-3:1985
Semiconductor devices-Mechanical and climatic test methods- Historical Version