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BS EN IEC 61760-3:2021

Surface mounting technology-Standard method for the specification of components for through-hole reflow (THR) soldering

standard by British-Adopted European Standard , 03/18/2021

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About This Item

 

Full Description

This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.

All current amendments available at time of purchase are included with the purchase of this document.
 

Product Details

Published:
03/18/2021
ISBN(s):
9780539045857
Number of Pages:
34
File Size:
1 file , 2.5 MB
Product Code(s):
30394490, 30394490, 30394490
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This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. BS EN IEC 61760-3:2021

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    Surface mounting technology-Standard method for the specification of components for through-hole reflow (THR) soldering

    • Most Recent

  2. BS EN 61760-3:2010


    Surface mounting technology-Standard method for the specification of components for through hole reflow (THR) soldering

    • Historical Version

  3. BS 09/30186180 DC


    BS EN 61760-3. Surface mounting technology. Part 3. Standard method for the specification of components for through hole reflow (THR) soldering

    • Historical Version