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About This Item
Full Description
- terms and definitions are rearranged in accordance with the alphabetical order;
- "reduced LN" is appended to terms and definitions;
- "reduced LT" is appended to terms and definitions;
- reduction process is appended to terms and definitions.
Document History
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IEC 62276 Ed. 3.0 b:2016
Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods- Most Recent
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IEC 62276 Ed. 3.0 en:2016
Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods- Historical Version
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IEC 62276 Ed. 2.0 b:2012
viewing
Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods- Historical Version
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IEC 62276 Ed. 1.0 en:2005
Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods- Historical Version