31.200: Integrated Circuits. Microelectronics

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  1. HISTORICAL

    16342

    ASTM F773M-96

    This document has been replaced. View the most recent version.

    Practice for Measuring Dose Rate Response of Linear Integrated Circuits

    standard by ASTM International, 06/10/1996.

    Languages: English

    Historical Editions: ASTM F773M-16ASTM F773M-10ASTM F773M-96(2003)

  2. HISTORICAL

    16660

    ASTM F1259M-96

    This document has been replaced. View the most recent version.

    Standard Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration [Metric]

    standard by ASTM International, 01/01/1996.

    Languages: English

    Historical Editions: ASTM F1259M-96(2003)

  3. HISTORICAL

    1087935

    ASTM F1262M-95(2002)

    This document has been replaced. View the most recent version.

    Standard Guide for Transient Radiation Upset Threshold of Digital Integrated Circuits

    standard by ASTM International, 12/10/2002.

    Languages: English

    Historical Editions: ASTM F1262M-14ASTM F1262M-95(2008)ASTM F1262M-95

  4. MOST RECENT

    1917452

    ASTM F773M-16 [ Withdrawn ]

    Standard Practice for Measuring Dose Rate Response of Linear Integrated Circuits (Metric) (Withdrawn 2023)

    standard by ASTM International, 05/01/2016.

    Languages: English

    Historical Editions: ASTM F773M-10ASTM F773M-96(2003)ASTM F773M-96

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  5. HISTORICAL

    13759

    ASTM F1513-99

    This document has been replaced. View the most recent version.

    Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications

    standard by ASTM International, 12/10/1999.

    Languages: English

    Historical Editions: ASTM F1513-99(2011)ASTM F1513-99(2003)

  6. HISTORICAL

    1149882

    ASTM F1513-99(2003)

    This document has been replaced. View the most recent version.

    Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications

    standard by ASTM International, 01/01/2003.

    Languages: English

    Historical Editions: ASTM F1513-99(2011)ASTM F1513-99

  7. MOST RECENT

    1805594

    ASTM F1513-99(2011) [ Withdrawn ]

    Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications (Withdrawn 2020)

    standard by ASTM International, 06/01/2011.

    Languages: English

    Historical Editions: ASTM F1513-99(2003)ASTM F1513-99

  8. HISTORICAL

    913334

    ASTM F1260M-96

    This document has been replaced. View the most recent version.

    Standard Test Method for Estimating Electromigration Median Time-To-Failure and Sigma of Integrated Circuit Metallizations [Metric]

    standard by ASTM International, 01/01/1996.

    Languages: English

    Historical Editions: ASTM F1260M-96(2003)

  9. HISTORICAL

    12965

    ASTM F744M-97

    This document has been replaced. View the most recent version.

    Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits

    standard by ASTM International, 01/01/1997.

    Languages: English

    Historical Editions: ASTM F744M-16ASTM F744M-10ASTM F744M-97(2003)

  10. MOST RECENT

    1916879

    ASTM F744M-16 [ Withdrawn ]

    Standard Test Method for Measuring Dose Rate Threshold for Upset of Digital Integrated Circuits (Metric) (Withdrawn 2023)

    standard by ASTM International, 05/01/2016.

    Languages: English

    Historical Editions: ASTM F744M-10ASTM F744M-97(2003)ASTM F744M-97

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