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BS 12/30271778 DC

BS EN 62137-4. Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices

standard by BSI Group , 09/13/2012

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Cross References:
IEC 60068-1:1998
IEC 60068-1:1998/AMD 2:1992
IEC 60068-2-14
IEC 61188-5-8
IEC 60191-6-2
IEC 60191-6-5
IEC 60194
IEC 61249-2-7
IEC 61249-2-8
IEC 60068-2-2
IEC 60068-2-44:1995
IEC 60068-2-58:2004
IEC 60068-2-78:2001
IEC 60326-2:2002
IEC 60749-1:2002
IEC 60749-20:2008
IEC 60749-20-1:2009
IEC 61189-3:2007
IEC 61189-5
IEC 61190-1-1
IEC 61190-1-2
IEC 61190-1-3
IEC 61760-1:2006
IEC 62137-1-3:2008
IEC 62137-1-4:2009
IEC 62137-3:2011


All current amendments available at time of purchase are included with the purchase of this document.
 

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Published:
09/13/2012
Number of Pages:
38
 

Document History

  1. BS EN 62137-4:2014


    Electronics assembly technology-Endurance test methods for solder joint of area array type package surface mount devices

    • Most Recent

  2. BS 12/30271778 DC

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    BS EN 62137-4. Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices

    • Historical Version

  3. BS DD IEC/PAS 62137-3:2008


    Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

    • Historical Version

  4. BS EN 62137:2004


    Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

    • Historical Version