BS DD IEC/PAS 62137-3:2008
Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints
standard by BSI Group , 01/31/2009
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About This Item
Full Description
Cross References:
IEC 60068-1:1988
IEC 60068-1:1988/AMD 1:1988
IEC 60068-2-2:2007
IEC 60068-2-14:1984
IEC 60068-2-14:1984/AMD 1:1986
IEC 60068-2-78:2001
IEC 60194:2006
IEC 61188-5
IEC 61190-1-1:2002
IEC 61190-1-2:2007
IEC 61249-2-7:2002
IEC 62137:2005
IEC 62137-1-1:2007
IEC 62137-1-2:2007
IEC 62137-1-3
IEC 62137-1-4
IEC 62137-1-5
All current amendments available at time of purchase are included with the purchase of this document.
Document History
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BS EN 62137-4:2014
Electronics assembly technology-Endurance test methods for solder joint of area array type package surface mount devices- Most Recent
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BS 12/30271778 DC
BS EN 62137-4. Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices- Historical Version
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BS DD IEC/PAS 62137-3:2008
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Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints- Historical Version
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BS EN 62137:2004
Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN- Historical Version
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