1184197

BS EN 62137:2004

Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

standard by British-Adopted European Standard , 05/13/2005

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Cross References:
IEC 60068-1:1988
EN 60068-1:1994
IEC 60191-6-2:2001
EN 60191-6-2:2002
IEC 60191-6-5:2001
EN 60191-6-5:2001
JEITA ETR-7001:1998
IEC 60068-2-44:1995
IEC 60068-2-58:2004
IEC 60326-2:1990
IEC 60749-1:2002
IEC 60749-20:2002
IEC 61189-3:1997
IEC 61189-5
IEC 61190-1-1
IEC 61190-1-2
IEC 61190-1-3
IEC 61760-1:1998
 

Product Details

Published:
05/13/2005
ISBN(s):
0580445054
Number of Pages:
30
File Size:
1 file , 570 KB
Product Code(s):
30133555, 30133555, 30133555
Note:
This product is unavailable in Ukraine, Russia, Belarus
 

Document History

  1. BS EN 62137-4:2014


    Electronics assembly technology-Endurance test methods for solder joint of area array type package surface mount devices

    • Most Recent

  2. BS 12/30271778 DC


    BS EN 62137-4. Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices

    • Historical Version

  3. BS DD IEC/PAS 62137-3:2008


    Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

    • Historical Version

  4. BS EN 62137:2004

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    Environmental and endurance testing. Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

    • Historical Version