BS EN 61190-1-2:2002
Attachment materials for electronic assembly-Requirements for solder pastes for high-quality interconnections in electronic assembly
standard by British-Adopted European Standard , 08/12/2002
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About This Item
Full Description
Cross References: IEC 61189-5*IEC 61189-6*IEC 61191-1*IEC 61191-2*IEC 61191-3*IEC 61191-4*ISO 9000 *ISO 9001*ISO 9453*ISO 10012-1*IEC 60194:1999*IEC 61190-1-1*EN 61190-1-1:2002*IEC 61190-1-3*EN 61190-1-3:2002*ISO 9002*EN ISO 9002:1994*ISO 9454-2*EN ISO 9454-2:2000*
Document History
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BS EN 61190-1-2:2014
Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly- Most Recent
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BS EN 61190-1-2:2007
Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly- Historical Version
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BS 05/30133283 DC
IEC 61190-1-2 ED 2. Attachment materials for electronic assembly. Part 1-2. Requirements for soldering paste for high-quality interconnects in electronics assembly- Historical Version
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BS EN 61190-1-2:2002
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Attachment materials for electronic assembly-Requirements for solder pastes for high-quality interconnections in electronic assembly- Historical Version
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