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About This Item
Full Description
Cross References:
IEC 60194
IEC 61189-5-3
IEC 61190-1-1
IEC 61190-1-3
ISO 9454-2
EN 60194
EN 61189-5-3
EN 61190-1-3
EN ISO 9454-2
IEC 61189-5:2006
IEC 61189-6:2006
EN 61189-5:2006
EN 61189-6:2006
IPC-HDBK-005
All current amendments available at time of purchase are included with the purchase of this document.
Document History
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BS EN 61190-1-2:2014
viewing
Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly- Most Recent
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BS EN 61190-1-2:2007
Attachment materials for electronic assembly-Requirements for soldering pastes for high-quality interconnects in electronics assembly- Historical Version
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BS 05/30133283 DC
IEC 61190-1-2 ED 2. Attachment materials for electronic assembly. Part 1-2. Requirements for soldering paste for high-quality interconnects in electronics assembly- Historical Version
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BS EN 61190-1-2:2002
Attachment materials for electronic assembly-Requirements for solder pastes for high-quality interconnections in electronic assembly- Historical Version