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About This Item
Full Description
Cross References:
IEC 60194
IEC 61188-5
IEC 61249-2-7
IEC 62137-1-1:2007
IEC 62137-1-2:2007
IEC 62137-1-3:2008
IEC 62137-1-4:2009
IEC 62137-1-5:2009
IEC 60068-1:1998
IEC 60068-2-2
IEC 60068-2-14
IEC 60068-2-78
IEC 61760-1
IEC 62137:2004
EN 60194
EN 61188-5
EN 61249-2-7
EN 62137-1-1:2007
EN 62137-1-2:2007
EN 62137-1-3:2009
EN 62137-1-4:2009
EN 62137-1-5:2009
All current amendments available at time of purchase are included with the purchase of this document.
Document History
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BS EN 62137-3:2012
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Electronics assembly technology-Selection guidance of environmental and endurance test methods for solder joints- Most Recent
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BS DD IEC/PAS 62137-3:2008
Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints- Historical Version