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Document History
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IEC 60191-6-18 Ed. 1.0 b:2010
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Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)- Most Recent
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IEC/PAS 60191-6-18 Ed. 1.0 en:2008
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)- Historical Version
Amendments, rulings, supplements, and errata
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IEC 60191-6-18 Ed. 1.0 b COR. 2:2010
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Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) -
IEC 60191-6-18 Ed. 1.0 b COR. 1:2010
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Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)