31.080:Semiconductor devices
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BS 04/30063259 DC
IEC 61988-4. Plasma display panels. Part 4. Environmental, endurance and mechanical
standard by BSI Group, 07/09/2004.
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BS 04/30113827 DC
Draft British Standard. IEC62374 ED.1. Time dependent dielectric breakdown test
standard by BSI Group, 05/19/2004.
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BS 04/30119207 DC
IEC 60747-20-1. Semiconductor devices. Part 20-1. Handling, packing, labelling, shipping and use of moisture reflow sensitive surface mount devices
standard by BSI Group, 08/27/2004.
Languages:
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BS 04/30126443 DC
IEC 60749-38 ED.1. Semiconductor devices mechanical and climatic test methods. Part 38. Soft error rate testing of electronic components
standard by BSI Group, 12/08/2004.
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BS 05/30127455 DC
IEC 62258-4 ED.1. Semiconductor die products. Part 4. Questionnaire for die users and suppliers
standard by BSI Group, 01/11/2005.
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BS 05/30135664 DC
IEC 60749-37. Semiconductor devices. Mechanical and climatic test methods. Part 37. Board level drop test method of components for handheld electronic products
standard by BSI Group, 06/30/2005.
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BS 05/30143244 DC
IEC 62341-1-1. Organic light emitting diode displays. Part 1-1. Generic specification
standard by BSI Group, 12/07/2005.
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BS IEC 60747-18-4:2023
Semiconductor devices-Semiconductor bio sensors. Evaluation method of noise characteristics of lens-free CMOS photonic array sensors
standard by British Standard / International Electrotechnical Commission, 03/27/2023.
Languages: English
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BS IEC 60747-19-1:2019
Semiconductor devices-Smart sensors. Control scheme of smart sensors
standard by British Standard / International Electrotechnical Commission, 11/29/2019.
Languages: English
Historical Editions: BS 18/30380453DC
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BS EN 60749-29:2003
This document has been replaced. View the most recent version.
Semiconductor devices. Mechanical and climatic test methods-Latch-up test
standard by British-Adopted European Standard, 06/29/2004.
Languages: English
Historical Editions: BS EN 60749-29:2011, BS EN 60749:1999, BS 6493-3:1985
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