01.100.25: Electrical and electronics engineering drawings

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  1. DIN 1304-9

    Letter symbols for physical quantities - Part 9: Symbols for equivalent circuits of piezoelectric crystals

    standard by Deutsches Institut Fur Normung E.V. (German National Standard), 01/01/2003.

    Languages: German

  2. DIN EN 60139

    Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges (IEC 60139:2000); German version EN 60139:2001

    standard by DIN-adopted European Standard, 10/01/2001.

    Languages: German

  3. HISTORICAL

    Std

    DIN EN 60191-1 [ Withdrawn ]

    This document has been replaced. View the most recent version.

    Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2007); German version EN 60191-1:2007

    standard by DIN-adopted European Standard, 11/01/2007.

    Languages: German

    Historical Editions: DIN EN IEC 60191-1 (2018)DIN EN 60191-1 - DRAFT (2017)

  4. HISTORICAL

    1951889

    DIN EN 60191-1 - DRAFT [ Withdrawn ]

    This document has been replaced. View the most recent version.

    Draft Document - Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 47D/886/CDV:2016); German version prEN 60191-1:2016

    standard by DIN-adopted European Standard, 05/01/2017.

    Languages: German, English

    Historical Editions: DIN EN IEC 60191-1 (2018)DIN EN 60191-1 (2007)

  5. DIN EN 60191-3

    Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999

    standard by DIN-adopted European Standard, 07/01/2000.

    Languages: German

    Amendments, rulings, and supplements: DIN EN 60191-3 Supplement 1 (2006)

  6. DIN EN 60191-3 Supplement 1

    Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms

    Amendment by DIN-adopted European Standard, 08/01/2006.

    Languages: German

  7. HISTORICAL

    Std

    DIN EN 60191-4 [ Withdrawn ]

    This document has been replaced. View the most recent version.

    Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002

    standard by DIN-adopted European Standard, 03/01/2003.

    Languages: German

    Historical Editions: DIN EN 60191-4 (2019)DIN EN 60191-4/A1 - DRAFT (2017)DIN EN 60191-4 (2014)

  8. DIN EN 60191-6 [ Withdrawn ]

    Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2004); German version EN 60191-6:2004

    standard by DIN-adopted European Standard, 04/01/2005.

    Languages: German

  9. DIN EN 60191-6

    Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009

    standard by DIN-adopted European Standard, 06/01/2010.

    Languages: German

  10. DIN EN 60191-6-1

    Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001

    standard by DIN-adopted European Standard, 08/01/2002.

    Languages: German