01.100.25: Electrical and electronics engineering drawings
Search Results
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DIN 1304-9
Letter symbols for physical quantities - Part 9: Symbols for equivalent circuits of piezoelectric crystals
standard by Deutsches Institut Fur Normung E.V. (German National Standard), 01/01/2003.
Languages: German
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DIN EN 60139
Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges (IEC 60139:2000); German version EN 60139:2001
standard by DIN-adopted European Standard, 10/01/2001.
Languages: German
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DIN EN 60191-1 [ Withdrawn ]
This document has been replaced. View the most recent version.
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2007); German version EN 60191-1:2007
standard by DIN-adopted European Standard, 11/01/2007.
Languages: German
Historical Editions: DIN EN IEC 60191-1 (2018), DIN EN 60191-1 - DRAFT (2017)
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DIN EN 60191-1 - DRAFT [ Withdrawn ]
This document has been replaced. View the most recent version.
Draft Document - Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 47D/886/CDV:2016); German version prEN 60191-1:2016
standard by DIN-adopted European Standard, 05/01/2017.
Languages: German, English
Historical Editions: DIN EN IEC 60191-1 (2018), DIN EN 60191-1 (2007)
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DIN EN 60191-3
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
standard by DIN-adopted European Standard, 07/01/2000.
Languages: German
Amendments, rulings, and supplements: DIN EN 60191-3 Supplement 1 (2006)
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DIN EN 60191-3 Supplement 1
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
Amendment by DIN-adopted European Standard, 08/01/2006.
Languages: German
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DIN EN 60191-4 [ Withdrawn ]
This document has been replaced. View the most recent version.
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:1999 + A1:2001 + A2:2002); German version EN 60191-4:1999 + A1:2002 + A2:2002
standard by DIN-adopted European Standard, 03/01/2003.
Languages: German
Historical Editions: DIN EN 60191-4 (2019), DIN EN 60191-4/A1 - DRAFT (2017), DIN EN 60191-4 (2014)
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DIN EN 60191-6 [ Withdrawn ]
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2004); German version EN 60191-6:2004
standard by DIN-adopted European Standard, 04/01/2005.
Languages: German
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DIN EN 60191-6
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009
standard by DIN-adopted European Standard, 06/01/2010.
Languages: German
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DIN EN 60191-6-1
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for gull-wing lead terminals (IEC 60191-6-1:2001); German version EN 60191-6-1:2001
standard by DIN-adopted European Standard, 08/01/2002.
Languages: German