1805585

ASTM F1238-95(2011) [ Withdrawn ]

Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications (Withdrawn 2020)

standard by ASTM International , 06/01/2011

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Full Description

1.1 This specification covers sputtering targets fabricated from metallic silicides (molybdenum silicide, tantalum silicide, titanium silicide, and tungsten silicide). These targets are referred to as refractory silicide targets, and are intended for use in microelectronic applications.

1.2 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.

 

Product Details

Published:
06/01/2011
Number of Pages:
3
File Size:
1 file , 65 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
 

Document History

  1. ASTM F1238-95(2011)

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    Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications (Withdrawn 2020)

    • Most Recent

  2. ASTM F1238-95(2003)


    Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications

    • Historical Version

  3. ASTM F1238-95(1999)


    Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications

    • Historical Version