BS EN 61191-4:2017 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).


Cross References:
IEC 61191-1:2013
IEC 60194:2015
IEC 61190-1-2:2014
j-std-003
IPC SM 817
IPC A610
j-std-020
j-std-006
IPC 9191:1999
IEC 61188-7:2017
IEC 61193-1:2001
IEC 61193-3:2013
IEC 61188-5-6:2003
IEC 62326-4:1996
IEC 61188-5-4:2007
IPC OI645:1993
IEC 61188-5-3:2007
J-STD-005:1995
IEC 61189-2:2006
IEC 62326-1:2002
IEC 61188-5-2:2003
IEC 62326-4-1:1996
J-STD-004:2004
IEC 61188-5-5:2007
IEC 60068-2-20:2008
IEC 61188-5-1:2002
IEC 60068-2-58:2015
ANSI J-STD-001:1992
ANSI-J-STD-002:1992
ISO 9001:2015
IPC TM 650:2007


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