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About This Item

 

Full Description

This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.

The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.

These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress).

All current amendments available at time of purchase are included with the purchase of this document.
 

Document History

  1. BS EN IEC 60749-30:2020

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    Semiconductor devices. Mechanical and climatic test methods-Preconditioning of non-hermetic surface mount devices prior to reliability testing

    • Most Recent
  2. BS EN 60749-30:2005+A1:2011


    Semiconductor devices. Mechanical and climatic test methods-Preconditioning of non-hermetic surface mount devices prior to reliability testing

    • Historical Version
  3. BS EN 60749-30:2005


    Semiconductor devices. Mechanical and climatic test methods. Preconditioning of non-hermetic surface mount devices prior to reliability testing

    • Historical Version