2752100

CEI EN 61191-3 [ Active ]

Printed board assemblies Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

standard by Comitato Elettrotecnico Italiano , 01/01/2018

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Full Description

This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

 

Product Details

Edition:
18
Published:
01/01/2018
Number of Pages:
30
File Size:
1 file , 2 MB
 

Document History

  1. CEI EN 61191-3

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    Printed board assemblies Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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  2. CEI EN 61191-3


    Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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