2728094

CEI EN IEC 61189-2-807 [ Active ]

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

standard by Comitato Elettrotecnico Italiano , 06/01/2022

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ENGLISH

This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

 

Product Details

Edition:
22
Published:
06/01/2022
Number of Pages:
18
File Size:
1 file , 2.3 MB