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DANSK DS/EN 60191-6-22 [ Active ]

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

standard by Dansk Standard , 04/09/2013

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Full Description

SAME AS IEC 60191-6-22

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

 

Product Details

Edition:
13
Published:
04/09/2013
Number of Pages:
22
File Size:
1 file , 1.5 MB
Product Code(s):
DS-021, DS-021