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DANSK DS/EN IEC 61249-2-51 [ Active ]

Materials for printed boards and other interconnecting structures – Part 2-51: Reinforced base materials, clad and unclad – Base materials for integrated circuit card carrier tape, unclad

standard by Dansk Standard , 06/19/2023

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About This Item

 

Full Description

IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials). This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.

 

Product Details

Edition:
23#
Published:
06/19/2023
Number of Pages:
26
File Size:
1 file , 1.6 MB
Product Code(s):
DS-026, DS-026
 

Document History

  1. DANSK DSF/FPREN IEC 61249-2-51


    Materials for printed boards and other interconnecting structures – Part 2-51: Reinforced base materials, clad and unclad – Base materials for Integrated circuit card carrier tape, unclad

    • Historical Version

  2. DANSK DSF/PREN IEC 61249-2-51


    Materials for printed boards and other interconnecting structures – Part 2-51: Reinforced base materials, clad and unclad – Base materials for Integrated Circuit card carrier tape, unclad

    • Historical Version

  3. DANSK DS/EN IEC 61249-2-51

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    Materials for printed boards and other interconnecting structures – Part 2-51: Reinforced base materials, clad and unclad – Base materials for integrated circuit card carrier tape, unclad

    • Most Recent