2654596

DANSK DSF/PREN IEC 61188-6-3 [ Draft ]

Circuit boards and circuit board assemblies – Design and use – Part 6-3: Land pattern design – Description of land pattern for through hole components (THT)

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Full Description

DRAFT

This International Standard specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of the IEC 61191-1, and IEC 61191-3.

 

Product Details

Edition:
23#
Number of Pages:
31
File Size:
1 file , 1.9 MB
Product Code(s):
DSF-021, DSF-021