Std

DIN EN IEC 60749-37

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022

standard by DIN EN IEC , 12/01/2023

View all product details

Most Recent

Track It

Language:
    • Available Formats
    •  
    • Availability
    • Priced From ( in USD )
    • Secure PDF 🔒
    • Immediate download
    • $111.40 $108.33
      you save $3.07
    • Add to Cart
    • Printed Edition
    • Ships in 1-2 business days
    • $134.72 $131.02
      you save $3.70
    • Add to Cart
    • Printed Edition + PDF
    • Immediate download
    • $146.28
    • Add to Cart

Customers Who Bought This Also Bought

 

About This Item

 

Product Details

Published:
12/01/2023
Number of Pages:
23
File Size:
1 file
Product Code(s):
3447309, 3447309, 3447309
 

Document History

  1. DIN EN IEC 60749-37

    👀 currently
    viewing


    Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022

    • Most Recent

  2. DIN EN IEC 60749-37 - DRAFT


    Draft Document - Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 47/2651/CDV:2020); German and English version prEN IEC 60749-37:2020

    • Historical Version

  3. DIN EN 60749-37


    Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2008); German version EN 60749-37:2008

    • Historical Version