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IEC 60068-2-54 Ed. 1.0 b:1985 [ Withdrawn ]

Environmental testing. Part 2: Tests. Test Ta: Soldering - Solderability testing by the wetting balance method

standard by International Electrotechnical Commission , 01/01/1985

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Full Description

Determines the solderability of component terminations of any shape. Specially suitable for reference testing and components that cannot be quantitatively tested by other methods.
 

Product Details

Edition:
1.0
Published:
01/01/1985
Number of Pages:
27
File Size:
1 file , 1.2 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 60068-2-69 Ed. 3.1 b:2019


    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method CONSOLIDATED EDITION

    • Most Recent

  2. IEC 60068-2-69 Ed. 3.0 b:2017


    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    • Historical Version

  3. IEC 60068-2-69 Ed. 2.0 b:2007


    Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

    • Historical Version

  4. IEC 60068-2-69 Ed. 2.0 en:2007


    Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

    • Historical Version

  5. IEC 60068-2-54 Ed. 2.0 b:2006


    Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

    • Historical Version

  6. IEC 60068-2-54 Ed. 2.0 en:2006


    Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

    • Historical Version

  7. IEC 60068-2-69 Ed. 1.0 b:1995


    Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

    • Historical Version

  8. IEC 60068-2-54 Ed. 1.0 b:1985

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    Environmental testing. Part 2: Tests. Test Ta: Soldering - Solderability testing by the wetting balance method

    • Historical Version