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IEC 60068-2-54 Ed. 2.0 en:2006

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

standard by International Electrotechnical Commission , 04/27/2006

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Full Description

Outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. It provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
 

Product Details

Edition:
2.0
Published:
04/27/2006
Number of Pages:
18
File Size:
1 file , 350 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 60068-2-69 Ed. 3.1 b:2019


    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method CONSOLIDATED EDITION

    • Most Recent

  2. IEC 60068-2-69 Ed. 3.0 b:2017


    Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    • Historical Version

  3. IEC 60068-2-69 Ed. 2.0 b:2007


    Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

    • Historical Version

  4. IEC 60068-2-69 Ed. 2.0 en:2007


    Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

    • Historical Version

  5. IEC 60068-2-54 Ed. 2.0 b:2006


    Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

    • Historical Version

  6. IEC 60068-2-54 Ed. 2.0 en:2006

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    Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

    • Historical Version

  7. IEC 60068-2-69 Ed. 1.0 b:1995


    Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

    • Historical Version

  8. IEC 60068-2-54 Ed. 1.0 b:1985


    Environmental testing. Part 2: Tests. Test Ta: Soldering - Solderability testing by the wetting balance method

    • Historical Version