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IEC 60191-6-18 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

standard by International Electrotechnical Commission , 01/07/2010

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About This Item

 

Full Description

IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
 

Product Details

Edition:
1.0
Published:
01/07/2010
Number of Pages:
40
File Size:
1 file , 1.1 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 60191-6-18 Ed. 1.0 b:2010

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    Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

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  2. IEC/PAS 60191-6-18 Ed. 1.0 en:2008


    Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

    • Historical Version
 

Amendments, rulings, supplements, and errata

  1. IEC 60191-6-18 Ed. 1.0 b COR. 2:2010

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    Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

  2. IEC 60191-6-18 Ed. 1.0 b COR. 1:2010

    Free
    Download


    Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)