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IEC 60749-3 Ed. 1.0 b:2002 [ Withdrawn ]

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection

standard by International Electrotechnical Commission , 04/09/2002

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About This Item

 

Full Description

Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.
 

Product Details

Edition:
1.0
Published:
04/09/2002
Number of Pages:
7
File Size:
1 file , 360 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 60749-3 Ed. 2.0 b:2017


    Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

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  2. IEC 60749-3 Ed. 2.0 en:2017


    Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

    • Historical Version

  3. IEC 60749-3 Ed. 1.0 b CORR1:2003


    Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

    • Historical Version

  4. IEC 60749-3 Ed. 1.0 b:2002

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    Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection

    • Historical Version
 

Amendments, rulings, supplements, and errata

  1. IEC 60749-3 Ed. 1.0 b CORR1:2003

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    Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination