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IEC 60749-30 Amd.1 Ed. 1.0 b:2011 [ Withdrawn ]

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Amendment by International Electrotechnical Commission , 05/25/2011

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Product Details

Edition:
1.0
Published:
05/25/2011
Number of Pages:
9
File Size:
1 file , 200 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Document History

  1. IEC 60749-30 Ed. 2.0 b:2020


    Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

    • Most Recent

  2. IEC 60749-30 Ed. 1.1 b:2011


    Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing CONSOLIDATED EDITION

    • Historical Version

  3. IEC 60749-30 Amd.1 Ed. 1.0 b:2011

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    Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

    • Historical Version

  4. IEC 60749-30 Ed. 1.0 b:2005


    Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

    • Historical Version