1811491

IEC 62047-10 Ed. 1.0 b:2011

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

standard by International Electrotechnical Commission , 07/26/2011

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Full Description

IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials.
 

Product Details

Edition:
1.0
Published:
07/26/2011
Number of Pages:
22
File Size:
1 file , 350 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus, Canada
 

Amendments, rulings, supplements, and errata

  1. IEC 62047-10 Ed. 1.0 b COR.1:2012

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    Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials